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Photoresist etch resistance enhancement using novel polycarbocyclic derivatives as additives

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dc.contributor.author Gogolides, E en
dc.contributor.author Argitis, P en
dc.contributor.author Couladouros, EA en
dc.contributor.author Vidali, VP en
dc.contributor.author Vasilopoulou, M en
dc.contributor.author Cordoyiannis, G en
dc.contributor.author Diakoumakos, CD en
dc.contributor.author Tserepi, A en
dc.date.accessioned 2014-06-06T06:45:35Z
dc.date.available 2014-06-06T06:45:35Z
dc.date.issued 2003 en
dc.identifier.issn 10711023 en
dc.identifier.uri http://dx.doi.org/10.1116/1.1535930 en
dc.identifier.uri http://62.217.125.90/xmlui/handle/123456789/2523
dc.subject.other Adamantanes en
dc.subject.other Anthracenes en
dc.subject.other Ohnishi number en
dc.subject.other Photoresist etch resistance enhancement en
dc.subject.other Polycarbocylic derivatives en
dc.subject.other Steroids en
dc.subject.other Additives en
dc.subject.other Chemical resistance en
dc.subject.other Functionally graded materials en
dc.subject.other Organic polymers en
dc.subject.other Photolithography en
dc.subject.other Plasma etching en
dc.subject.other Polymethyl methacrylates en
dc.subject.other Synthesis (chemical) en
dc.subject.other Photoresists en
dc.title Photoresist etch resistance enhancement using novel polycarbocyclic derivatives as additives en
heal.type journalArticle en
heal.identifier.primary 10.1116/1.1535930 en
heal.publicationDate 2003 en
heal.abstract An overview is given of novel photoresist etch resistance promoters characterized by the presence of at least two polycarbocyclic moieties in their molecular, where at least one of them is anthracene derivative. The requirement for etch resistance enhancement is that the Ohnishi number of the additives is lower compared to the original photoresist, or in other terms, the ring Parameter of the additive is higher compared to the ring parameter of the original photoresist. en
heal.journalName Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures en
dc.identifier.issue 1 SPEC. en
dc.identifier.volume 21 en
dc.identifier.doi 10.1116/1.1535930 en
dc.identifier.spage 141 en
dc.identifier.epage 147 en


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